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Temperature Controlling Precision ±1C Semi Automatic BGA Rework Station with

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Temperature Controlling Precision ±1C Semi Automatic BGA Rework Station with

Temperature Controlling Precision ±1C Semi Automatic BGA Rework Station with

Product Description: The WDS620 is capable of handling a wide range of chip sizes, with the applicable chips ranging from max 70*70mm to min 1*1mm. The locating way of the WDS620 features V shape slot ...

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